发明授权
- 专利标题： Printed circuit board and method of manufacturing the same
- 专利标题（中）： 印刷电路板及其制造方法
-
申请号： US12731173申请日： 2010-03-25
-
公开(公告)号： US08350159B2公开(公告)日： 2013-01-08
- 发明人: Tetsuya Oosawa , Naoyuki Tanaka , Mitsuru Honjo
- 申请人： Tetsuya Oosawa , Naoyuki Tanaka , Mitsuru Honjo
- 申请人地址： JP Osaka
- 专利权人： Nitto Denko Corporation
- 当前专利权人： Nitto Denko Corporation
- 当前专利权人地址： JP Osaka
- 代理机构： Panitch Schwarze Belisario & Nadel LLP
- 优先权： JP2009-077246 20090326
- 主分类号： H05K1/00
- IPC分类号： H05K1/00 ; H05K1/09 ; H05K1/03 ; H05K7/00 ; G11B21/16 ; G11B5/48
摘要：
A base insulating layer is formed on a suspension body, and write wiring traces and read wiring traces are formed on the base insulating layer. The write wiring trace and the read wiring traces are formed on a body region of the base insulating layer, and the write wiring trace is formed on an auxiliary region of the base insulating layer. The base insulating layer is bent along a bend portion. This causes the write wiring trace to be positioned above the write wiring trace.