Invention Grant
- Patent Title: Structure, electronic device, and method for fabricating a structure
- Patent Title (中): 结构,电子器件和制造结构的方法
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Application No.: US13060994Application Date: 2008-08-25
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Publication No.: US08350160B2Publication Date: 2013-01-08
- Inventor: Tadashi Sakai , Naoshi Sakuma , Masayuki Katagiri , Mariko Suzuki
- Applicant: Tadashi Sakai , Naoshi Sakuma , Masayuki Katagiri , Mariko Suzuki
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- International Application: PCT/JP2008/065128 WO 20080825
- International Announcement: WO2010/023720 WO 20100304
- Main IPC: H05K1/09
- IPC: H05K1/09

Abstract:
A structure includes a conductive film (12) provided in an underlying layer (10); and a carbon nanotube bundle (20) including a plurality of carbon nanotubes each having one end connected to the conductive film (12), wherein, at other end side of the carbon nanotube bundle (20), at least carbon nanotubes allocated at outer side of the carbon nanotube bundle (20) extend with convex curvatures toward the outside of the carbon nanotube bundle (20), and the convex curvatures of the carbon nanotubes allocated at the outer side of the carbon nanotube bundle are larger than those of inner side of the carbon nanotube bundle (20), and diameters of the carbon nanotube bundle (20) decrease toward the other end of the carbon nanotube bundle (20).
Public/Granted literature
- US20110147177A1 STRUCTURE, ELECTRONIC DEVICE, AND METHOD FOR FABRICATING A STRUCTURE Public/Granted day:2011-06-23
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