Invention Grant
- Patent Title: Circuit board and structure using the same
- Patent Title (中): 电路板和结构使用相同
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Application No.: US12696962Application Date: 2010-01-29
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Publication No.: US08350161B2Publication Date: 2013-01-08
- Inventor: Kimihiro Yamanaka , Manabu Ichinose , Satoshi Nakamura
- Applicant: Kimihiro Yamanaka , Manabu Ichinose , Satoshi Nakamura
- Applicant Address: JP Kyoto
- Assignee: Kycera Corporation
- Current Assignee: Kycera Corporation
- Current Assignee Address: JP Kyoto
- Agency: DLA Piper (US) LLP
- Priority: JP2009-020175 20090130; JP2009-042842 20090225
- Main IPC: H01R12/04
- IPC: H01R12/04 ; H05K1/11 ; H05K1/03 ; H05K1/09 ; H05K1/16 ; H05K7/00 ; H05K7/10 ; H05K7/12 ; H05K7/02 ; H05K7/04

Abstract:
According to one of the invention, a circuit board comprises a conductive layer. The conductive layer includes a first land portion, a second land portion apart from the first land portion in a plan view, and a line portion connecting the first land portion and the second land portion to each other. The line portion includes lead portions through which a current is to flow and an opening portion arranged between the lead portions. The opening portion penetrates the conductive layer in a thickness direction.
Public/Granted literature
- US20100193231A1 Circuit Board and Structure Using the Same Public/Granted day:2010-08-05
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