Invention Grant
- Patent Title: Laser-produced implants
- Patent Title (中): 激光生产植入物
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Application No.: US11648703Application Date: 2006-12-29
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Publication No.: US08350186B2Publication Date: 2013-01-08
- Inventor: Eric Jones , Christopher J. Sutcliffe , Aiguo Wang , Daniel E. Lawrynowicz
- Applicant: Eric Jones , Christopher J. Sutcliffe , Aiguo Wang , Daniel E. Lawrynowicz
- Applicant Address: US NJ Mahwah
- Assignee: Howmedica Osteonics Corp.
- Current Assignee: Howmedica Osteonics Corp.
- Current Assignee Address: US NJ Mahwah
- Agency: Lerner, David, Littenberg, Krumholz & Mentlik, LLP
- Main IPC: B23K26/00
- IPC: B23K26/00

Abstract:
A method of producing an orthopedic implant including the steps of building a flat open model of at least a portion of an implant. The flat open model may be built using a selective laser sinter process. The flat open model preferably includes at least one groove along either a first surface or a second surface of the model. Next a force may be applied to the flat open model at predetermined locations to thereby cause the model to bend and assume a shape similar to a desired result. The now bent model may be resurfaced by either applying additional material such that the bent flat open model assumes the shape of a desired implant or the bent open model may be snap fit to an additional element.
Public/Granted literature
- US20080004709A1 Laser-produced implants Public/Granted day:2008-01-03
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