Embodiments of apparatus for thermally conditioning probe cards prior to use in a testing system are provided herein. In some embodiments, a probe card thermal conditioning system may include an enclosure configured to support a probe card and a heat transfer element disposed proximate a bottom of the enclosure for thermally conditioning the probe card prior to installation in a prober. The heat transfer element may be a heating and/or cooling element. A controller may be provided for controlling operation of the heat transfer element, optionally with temperature feedback. Multiple enclosures may be provided for independently conditioning multiple probe cards. The enclosure may be contained in a cart or may be part of shipping container for shipping a probe card. A fan may be provided for circulating air within the enclosure. The fan may facilitate providing a dry purge gas to prevent condensate from forming on the probe card.