Invention Grant
- Patent Title: Resistive random access memory having a solid solution layer and method of manufacturing the same
- Patent Title (中): 具有固溶层的电阻随机存取存储器及其制造方法
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Application No.: US11984277Application Date: 2007-11-15
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Publication No.: US08350247B2Publication Date: 2013-01-08
- Inventor: Myoung-jae Lee , Young-soo Park , Ran-ju Jung , Sun-ae Seo , Dong-chul Kim , Seung-eon Ahn
- Applicant: Myoung-jae Lee , Young-soo Park , Ran-ju Jung , Sun-ae Seo , Dong-chul Kim , Seung-eon Ahn
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2006-0113385 20061116
- Main IPC: H01L47/00
- IPC: H01L47/00

Abstract:
A resistive random access memory (RRAM) having a solid solution layer and a method of manufacturing the RRAM are provided. The RRAM includes a lower electrode, a solid solution layer on the lower electrode, a resistive layer on the solid solution layer, and an upper electrode on the resistive layer. The method of manufacturing the RRAM includes forming a lower electrode, forming a solid solution layer on the lower electrode, forming a resistive layer on the solid layer and forming an upper electrode on the resistive layer, wherein the RRAM is formed of a transition metal solid solution.
Public/Granted literature
- US20080116438A1 Resistive random access memory having a solid solution layer and method of manufacturing the same Public/Granted day:2008-05-22
Information query
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