An electronic circuit includes at least two organic components interconnected by conductor tracks and having a common carrier substrate. The components and the conductor tracks are formed from layer portions. An uppermost layer portion, remote from the carrier substrate, of the electronic circuit is of a patterned configuration comprising an electrically conducting material. The patterned uppermost layer portion on its side remote from the carrier substrate is provided with at least one protective layer arranged in congruent relationship with the uppermost layer portion. The at least two organic components include at least one first component of a first component type and at least one second component of a second component type different therefrom. Components of the same component type are respectively protected by a protective layer of the same composition and/or the same structure corresponding to that component type and differing from one another according to the corresponding component type.