Invention Grant
- Patent Title: Silicon carbide semiconductor device and method for manufacturing the same
- Patent Title (中): 碳化硅半导体器件及其制造方法
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Application No.: US12921250Application Date: 2009-03-04
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Publication No.: US08350270B2Publication Date: 2013-01-08
- Inventor: Shoyu Watanabe , Shuhei Nakata , Kenichi Ohtsuka
- Applicant: Shoyu Watanabe , Shuhei Nakata , Kenichi Ohtsuka
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2008-057696 20080307
- International Application: PCT/JP2009/000965 WO 20090304
- International Announcement: WO2009/110229 WO 20090911
- Main IPC: H01L29/161
- IPC: H01L29/161

Abstract:
A silicon carbide MOSFET that exhibits a high source-to-drain withstand voltage and that involves a smaller difference between gate-to-drain capacitance achieved in an activated state and gate-to-drain capacitance achieved in a deactivated state. A silicon carbide drift layer of a first conductivity type is provided on a silicon carbide substrate of a first conductivity type; a pair of base regions are provided in a surface layer portion of the silicon carbide drift layer and exhibit a second conductivity type; a pair of source regions are provided in interiors of surface layer portions of the pair of base regions and exhibit a first conductivity type; and semi-insulating regions are provided between the silicon carbide substrate and the pair of base regions.
Public/Granted literature
- US20110012133A1 SILICON CARBIDE SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2011-01-20
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