Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US13087118Application Date: 2011-04-14
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Publication No.: US08350272B2Publication Date: 2013-01-08
- Inventor: Nobuo Tsuboi , Masakazu Okada
- Applicant: Nobuo Tsuboi , Masakazu Okada
- Applicant Address: JP Kanagawa
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Kanagawa
- Agency: McDermott Will & Emery LLP
- Priority: JP2010-110296 20100512
- Main IPC: H01L29/12
- IPC: H01L29/12

Abstract:
A semiconductor device which is designed based on RDR, suppresses the occurrence of a trouble at the boundary between an active region and a power wire and therearound and is small in size and highly integrated. The semiconductor device includes a first conductive impurity region for functional elements which is formed over the main surface of a semiconductor substrate and a second conductive impurity region for power potential to which power potential is applied in at least one standard cell. It also includes insulating layers which are formed over the main surface of the semiconductor substrate and have throughholes reaching the main surface of the semiconductor substrate, and a conductive layer for contact formed in the throughholes of the insulating layers. The impurity region for functional elements and the impurity region for power potential are electrically coupled to each other through the conductive layer for contact which is formed astride the impurity region for functional elements and the impurity region for power potential.
Public/Granted literature
- US20110278592A1 SEMICONDUCTOR DEVICE Public/Granted day:2011-11-17
Information query
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