Invention Grant
- Patent Title: Semiconductor structure and a method of forming the same
- Patent Title (中): 半导体结构及其形成方法
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Application No.: US12551021Application Date: 2009-08-31
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Publication No.: US08350273B2Publication Date: 2013-01-08
- Inventor: Martin Henning Albrecht Vielemeyer
- Applicant: Martin Henning Albrecht Vielemeyer
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L29/04
- IPC: H01L29/04

Abstract:
Some embodiments show a semiconductor structure including a substrate with a {100} crystal surface plane which includes a plurality of adjacent structured regions at a top side of the substrate. The plurality of adjacent structured regions includes adjacent substrate surfaces with {111} crystal planes and a III-V semiconductor material layer above the top side of the substrate. A semiconductor device region includes at least one semiconductor device structure. The semiconductor device region is arranged above the plurality of adjacent structured regions at the top side of the substrate.
Public/Granted literature
- US20110049681A1 Semiconductor Structure and a Method of Forming the Same Public/Granted day:2011-03-03
Information query
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