Invention Grant
- Patent Title: Light emitting element
- Patent Title (中): 发光元件
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Application No.: US13187090Application Date: 2011-07-20
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Publication No.: US08350287B2Publication Date: 2013-01-08
- Inventor: Tae Won Seo , Zhbanov Alexander , Dae Won Kim
- Applicant: Tae Won Seo , Zhbanov Alexander , Dae Won Kim
- Applicant Address: KR Seoul
- Assignee: Seoul Semiconductor Co., Ltd.
- Current Assignee: Seoul Semiconductor Co., Ltd.
- Current Assignee Address: KR Seoul
- Agency: H.C. Park & Associates, PLC
- Priority: KR10-2005-0111255 20051121; KR10-2005-0112440 20051123
- Main IPC: H01L33/00
- IPC: H01L33/00

Abstract:
A heat radiation structure of a light emitting element has leads, each lead having a plurality of leg sections, and a light emitting chip mounted on any one of the leads. The present invention can provide a high-efficiency light emitting element, in which a thermal load is reduced by widening a connecting section through which a lead and a chip seating section of the light emitting element are connected, and the heat generated from a heat source can be more rapidly radiated to the outside. Further, the present invention can also provide a high-efficiency light emitting element, in which heat radiation fins are formed between a stopper and a molding portion of a lead of the light emitting element so that natural convection can occur between the heat radiation fins, and an area in which heat radiation can occur is widened to maximize a heat radiation effect.
Public/Granted literature
- US20110278636A1 LIGHT EMITTING ELEMENT Public/Granted day:2011-11-17
Information query
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