Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US12545628Application Date: 2009-08-21
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Publication No.: US08350289B2Publication Date: 2013-01-08
- Inventor: Masanori Tsukuda
- Applicant: Masanori Tsukuda
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Patterson & Sheridan, LLP
- Priority: JP2008-269069 20081017
- Main IPC: H01L29/66
- IPC: H01L29/66

Abstract:
A semiconductor device includes: a first semiconductor layer; a first electrode provided on a first surface side of the first semiconductor layer; a first insulating layer; and a second semiconductor layer. The first insulating layer is provided between the first semiconductor layer and the first electrode and configured to constrict current flowing between the first semiconductor layer and the first electrode. The second semiconductor layer has a first conductivity type and is provided at least on a path of the current constricted by the first insulating layer. The second semiconductor layer is in contact with the first electrode. The second semiconductor layer contains first impurities at a concentration higher than a concentration of impurities contained in the first semiconductor layer.
Public/Granted literature
- US20100096664A1 SEMICONDUCTOR DEVICE Public/Granted day:2010-04-22
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