Invention Grant
- Patent Title: Modulation-doped multi-gate devices
- Patent Title (中): 调制掺杂多栅极器件
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Application No.: US13248197Application Date: 2011-09-29
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Publication No.: US08350291B2Publication Date: 2013-01-08
- Inventor: Mantu K. Hudait , Ravi Pillarisetty , Marko Radosavljevic , Gilbert Dewey , Jack T. Kavalieros
- Applicant: Mantu K. Hudait , Ravi Pillarisetty , Marko Radosavljevic , Gilbert Dewey , Jack T. Kavalieros
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Cool Patent, P.C.
- Agent Joseph P. Curtin
- Main IPC: H01L29/78
- IPC: H01L29/78

Abstract:
Modulation-doped multi-gate devices are generally described. In one example, an apparatus includes a semiconductor substrate having a surface, one or more buffer films coupled to the surface of the semiconductor substrate, a first barrier film coupled to the one or more buffer films, a multi-gate fin coupled to the first barrier film, the multi-gate fin comprising a source region, a drain region, and a channel region of a multi-gate device wherein the channel region is disposed between the source region and the drain region, a spacer film coupled to the multi-gate fin, and a doped film coupled to the spacer film.
Public/Granted literature
- US20120018781A1 MODULATION-DOPED MULTI-GATE DEVICES Public/Granted day:2012-01-26
Information query
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