Invention Grant
- Patent Title: Hybrid material inversion mode GAA CMOSFET
- Patent Title (中): 混合材料反演模式GAA CMOSFET
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Application No.: US12810619Application Date: 2010-02-11
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Publication No.: US08350298B2Publication Date: 2013-01-08
- Inventor: Deyuan Xiao , Xi Wang , Miao Zhang , Jing Chen , Zhongying Xue
- Applicant: Deyuan Xiao , Xi Wang , Miao Zhang , Jing Chen , Zhongying Xue
- Applicant Address: CN Changning District, Shanghai
- Assignee: Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences
- Current Assignee: Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences
- Current Assignee Address: CN Changning District, Shanghai
- Agency: Global IP Services
- Agent Tianhua Gu
- Priority: CN200910199722 20091201
- International Application: PCT/CN2010/070643 WO 20100211
- International Announcement: WO2011/066727 WO 20110609
- Main IPC: H01L27/12
- IPC: H01L27/12 ; H01L21/00 ; H01L21/84 ; H01L27/06 ; H01L29/423 ; H01L29/786

Abstract:
A Ge and Si hybrid material inversion mode GAA (Gate-All-Around) CMOSFET includes a PMOS region having a first channel, an NMOS region having a second channel and a gate region. The first channel and the second channel have a racetrack-shaped cross section and are formed of n-type Ge and p-type Si, respectively; the surfaces of the first channel and the second channel are substantially surrounded by the gate region; a buried oxide layer is disposed between the PMOS region and the NMOS region and between the PMOS or NMOS region and the Si substrate to isolate them from one another. In an inversion mode, the devices have hybrid material, GAA structure with the racetrack-shaped, high-k gate dielectric layer and metal gate, so as to achieve high carrier mobility, prevent polysilicon gate depletion and short channel effects.
Public/Granted literature
- US20110248354A1 HYBRID MATERIAL INVERSION MODE GAA CMOSFET Public/Granted day:2011-10-13
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