Invention Grant
- Patent Title: Semiconductor photodiode device and manufacturing method thereof
- Patent Title (中): 半导体光电二极管装置及其制造方法
-
Application No.: US12838444Application Date: 2010-07-17
-
Publication No.: US08350301B2Publication Date: 2013-01-08
- Inventor: Makoto Miura , Shinichi Saito , Youngkun Lee , Katsuya Oda
- Applicant: Makoto Miura , Shinichi Saito , Youngkun Lee , Katsuya Oda
- Applicant Address: JP Tokyo
- Assignee: Hitachi, Ltd.
- Current Assignee: Hitachi, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Miles and Stockbridge P.C.
- Priority: JP2009-184003 20090807
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
A semiconductor photodiode includes a semiconductor substrate; a first conduction type first semiconductor layer formed above the semiconductor substrate; a high resistance second semiconductor layer formed above the first semiconductor layer; a first conduction type third semiconductor layer formed above the second semiconductor layer; and a second conduction type fourth semiconductor layer buried in the second semiconductor layer, in which the fourth semiconductor layer is separated at a predetermined distance in a direction horizontal to the surface of the semiconductor substrate.
Public/Granted literature
- US20110031578A1 SEMICONDUCTOR PHOTODIODE DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2011-02-10
Information query
IPC分类: