发明授权
- 专利标题： Capacitor to be incorporated in wiring substrate, method for manufacturing the capacitor, and wiring substrate
- 专利标题（中）： 配线基板中的电容器，电容器的制造方法以及布线基板
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申请号： US12951739申请日： 2010-11-22
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公开(公告)号： US08350306B2公开(公告)日： 2013-01-08
- 发明人: Motohiko Sato , Kazuhiro Hayashi , Kenji Murakami , Motonobu Kurahashi , Yusuke Kaieda , Jun Otsuka , Manabu Sato
- 申请人： Motohiko Sato , Kazuhiro Hayashi , Kenji Murakami , Motonobu Kurahashi , Yusuke Kaieda , Jun Otsuka , Manabu Sato
- 申请人地址： JP Aichi
- 专利权人： NGK Spark Plug Co., Ltd.
- 当前专利权人： NGK Spark Plug Co., Ltd.
- 当前专利权人地址： JP Aichi
- 代理机构： Sughrue Mion, PLLC
- 优先权： JP2005-370945 20051222; JP2005-370946 20051222; JP2005-370947 20051222
- 主分类号： H01L21/02
- IPC分类号： H01L21/02
摘要：
A wiring substrate in which a capacitor is provided, the capacitor comprising a capacitor body including a plurality of dielectric layers and internal electrode layers provided between the different dielectric layers, wherein said capacitor body has, in at least one side face of said capacitor body, recesses extending in a thickness direction of said capacitor body from at least one of a first principal face of said capacitor body and a second principal face positioned on the side opposite to the first principal face.