Invention Grant
US08350307B2 Semiconductor memory device with power decoupling capacitors and method of fabrication
有权
具有电源去耦电容器的半导体存储器件及其制造方法
- Patent Title: Semiconductor memory device with power decoupling capacitors and method of fabrication
- Patent Title (中): 具有电源去耦电容器的半导体存储器件及其制造方法
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Application No.: US12539824Application Date: 2009-08-12
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Publication No.: US08350307B2Publication Date: 2013-01-08
- Inventor: Sunghoon Kim
- Applicant: Sunghoon Kim
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Volentine & Whitt, PLLC
- Priority: KR10-2008-0096116 20080930
- Main IPC: H01L29/94
- IPC: H01L29/94 ; H01L21/8242

Abstract:
Provided is a semiconductor memory device including a capacitor structure extending over core and peripheral areas of a substrate. Respective portions of the capacitor structure function as memory cell capacitors in the core area and as first and second capacitors in the peripheral area. A combination of the first and second capacitors functions as a first power decoupling capacitor, and a transistor disposed in the peripheral area functions as a second power decoupling capacitor.
Public/Granted literature
- US20100078696A1 SEMICONDUCTOR MEMORY DEVICE WITH POWER DECOUPLING CAPACITORS AND METHOD OF FABRICATION Public/Granted day:2010-04-01
Information query
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