Invention Grant
- Patent Title: Semiconductor device including memory cell having capacitor
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Application No.: US13473242Application Date: 2012-05-16
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Publication No.: US08350310B2Publication Date: 2013-01-08
- Inventor: Hiroyuki Ogawa , Hiroyoshi Tomita , Masato Takita
- Applicant: Hiroyuki Ogawa , Hiroyoshi Tomita , Masato Takita
- Applicant Address: JP Yokohama
- Assignee: Fujitsu Semiconductor Limited
- Current Assignee: Fujitsu Semiconductor Limited
- Current Assignee Address: JP Yokohama
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2009-37904 20090220
- Main IPC: H01L27/108
- IPC: H01L27/108

Abstract:
A semiconductor device includes a semiconductor substrate; a memory cell array including a plurality of memory cells formed on the semiconductor substrate and arranged in a matrix in a first direction and a second direction on the surface of the semiconductor substrate; a plurality of sense amplifiers formed on the semiconductor substrate and including a first sense amplifier and a second sense amplifier; and a plurality of bit lines extending along the first direction above the memory cell array, and arranged side by side in the second direction, wherein the plurality of bit lines include a first bit line pair formed in a first wiring layer and a second bit line pair formed in a second wiring layer located above the first wiring layer.
Public/Granted literature
- US20120225531A1 SEMICONDUCTOR DEVICE INCLUDING MEMORY CELL HAVING CAPACITOR Public/Granted day:2012-09-06
Information query
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