Invention Grant
- Patent Title: Semiconductor device and method of manufacturing the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US12619222Application Date: 2009-11-16
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Publication No.: US08350332B2Publication Date: 2013-01-08
- Inventor: Tsutomu Oosuka , Yoshihiro Sato , Hisashi Ogawa
- Applicant: Tsutomu Oosuka , Yoshihiro Sato , Hisashi Ogawa
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP2008-066543 20080314
- Main IPC: H01L27/092
- IPC: H01L27/092

Abstract:
A first and second gate electrodes are formed on a first and second active regions, respectively. The first and second gate electrodes have a first and second metal-containing conductive films, respectively. The first and second metal-containing conductive films are formed on the isolation region for segmenting the first and second active regions to be spaced apart from each other. A third metal-containing conductive film, which is a part of each of the first and second gate electrodes, is continuously formed from a top of the first metal-containing conductive film through a top of the isolation region to a top of the second metal-containing conductive film. The third metal-containing conductive film is in contact with the first and second metal-containing conductive films.
Public/Granted literature
- US20100059827A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2010-03-11
Information query
IPC分类: