Invention Grant
- Patent Title: Solid-state imaging device, method of manufacturing thereof, and electronic apparatus
- Patent Title (中): 固态成像装置,其制造方法和电子装置
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Application No.: US13013981Application Date: 2011-01-26
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Publication No.: US08350349B2Publication Date: 2013-01-08
- Inventor: Atsushi Toda
- Applicant: Atsushi Toda
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: SNR Denton US LLP
- Priority: JP2010-021219 20100202
- Main IPC: H01L27/00
- IPC: H01L27/00 ; H01L31/18

Abstract:
Provided is a solid-state imaging device including a first photoelectric-conversion-portion selectively receiving a first wavelength light in incident light and performing photoelectric conversion; and a second photoelectric-conversion-portion selectively receiving a second wavelength light which is shorter than the first wavelength, wherein the first photoelectric-conversion-portion is laminated above the second photoelectric-conversion-portion in an imaging area of a substrate so that the second photoelectric-conversion-portion receives the light transmitting the first photoelectric-conversion-portion, wherein a transmitting portion is formed in the first photoelectric-conversion-portion so that the second wavelength light transmits the second photoelectric-conversion-portion more than other portions, and wherein the transmitting portion is formed to include a portion satisfying the following Equation within a width D defined in the direction of the imaging area, a refraction index n of a peripheral portion of the transmitting portion, and the longest wavelength λc of the second wavelength range selectively photoelectrically-converted in the second photoelectric-conversion-portion: λc/n≦2D.
Public/Granted literature
- US20110186952A1 SOLID-STATE IMAGING DEVICE, METHOD OF MANUFACTURING THEREOF, AND ELECTRONIC APPARATUS Public/Granted day:2011-08-04
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