Invention Grant
US08350349B2 Solid-state imaging device, method of manufacturing thereof, and electronic apparatus 有权
固态成像装置,其制造方法和电子装置

  • Patent Title: Solid-state imaging device, method of manufacturing thereof, and electronic apparatus
  • Patent Title (中): 固态成像装置,其制造方法和电子装置
  • Application No.: US13013981
    Application Date: 2011-01-26
  • Publication No.: US08350349B2
    Publication Date: 2013-01-08
  • Inventor: Atsushi Toda
  • Applicant: Atsushi Toda
  • Applicant Address: JP Tokyo
  • Assignee: Sony Corporation
  • Current Assignee: Sony Corporation
  • Current Assignee Address: JP Tokyo
  • Agency: SNR Denton US LLP
  • Priority: JP2010-021219 20100202
  • Main IPC: H01L27/00
  • IPC: H01L27/00 H01L31/18
Solid-state imaging device, method of manufacturing thereof, and electronic apparatus
Abstract:
Provided is a solid-state imaging device including a first photoelectric-conversion-portion selectively receiving a first wavelength light in incident light and performing photoelectric conversion; and a second photoelectric-conversion-portion selectively receiving a second wavelength light which is shorter than the first wavelength, wherein the first photoelectric-conversion-portion is laminated above the second photoelectric-conversion-portion in an imaging area of a substrate so that the second photoelectric-conversion-portion receives the light transmitting the first photoelectric-conversion-portion, wherein a transmitting portion is formed in the first photoelectric-conversion-portion so that the second wavelength light transmits the second photoelectric-conversion-portion more than other portions, and wherein the transmitting portion is formed to include a portion satisfying the following Equation within a width D defined in the direction of the imaging area, a refraction index n of a peripheral portion of the transmitting portion, and the longest wavelength λc of the second wavelength range selectively photoelectrically-converted in the second photoelectric-conversion-portion: λc/n≦2D.
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