Invention Grant
- Patent Title: Multi-chip package including chip address circuit
- Patent Title (中): 多芯片封装，包括芯片地址电路
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Application No.: US13151724Application Date: 2011-06-02
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Publication No.: US08350374B2Publication Date: 2013-01-08
- Inventor: Jin Yong Seong
- Applicant: Jin Yong Seong
- Applicant Address: KR Gyeonggi-do
- Assignee: Hynix Semiconductor Inc.
- Current Assignee: Hynix Semiconductor Inc.
- Current Assignee Address: KR Gyeonggi-do
- Agency: IP & T Group LLP
- Priority: KR10-2010-0066494 20100709
- Main IPC: H01L23/02
- IPC: H01L23/02 ; H01L23/52 ; H01L23/34
Abstract:
A multi-chip package according to an aspect of this disclosure includes a plurality of multi-chips. Each of the multi-chips includes a lead configured to receive an external power supply voltage, and a pad circuit configured to reset an internal node to the level of a ground voltage and to generate chip address information by controlling the potential of the internal node based on the state of a connection between the pad circuit and the lead.
Public/Granted literature
- US20120007248A1 MULTI-CHIP PACKAGE INCLUDING CHIP ADDRESS CIRCUIT Public/Granted day:2012-01-12
Information query
IPC分类:
