Invention Grant
- Patent Title: Package with power and ground through via
- Patent Title (中): 通过电源和接地的封装
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Application No.: US12206786Application Date: 2008-09-09
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Publication No.: US08350379B2Publication Date: 2013-01-08
- Inventor: Qwai H. Low , Chengyu Guo
- Applicant: Qwai H. Low , Chengyu Guo
- Applicant Address: US CA Milpitas
- Assignee: LSI Corporation
- Current Assignee: LSI Corporation
- Current Assignee Address: US CA Milpitas
- Agency: Luedeka Neely Group, P.C.
- Main IPC: H01L23/04
- IPC: H01L23/04
Abstract:
A wire bond design integrated circuit with a substrate having a front side and an opposing back side. Circuitry is disposed on the font side. Electrically conductive vias are disposed through the substrate from the front side to the back side, and are electrically connected to the circuitry such that the electrically conductive vias provide power and ground services only for the circuitry. Bonding pads are disposed on the front side, and are electrically connected to the circuitry such that the bonding pads provide signal communication only for the circuitry.
Public/Granted literature
- US20100059865A1 Package with Power and Ground Through Via Public/Granted day:2010-03-11
Information query
IPC分类:
