Invention Grant
- Patent Title: Device and method for manufacturing a device
- Patent Title (中): 用于制造设备的装置和方法
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Application No.: US12752851Application Date: 2010-04-01
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Publication No.: US08350381B2Publication Date: 2013-01-08
- Inventor: Horst Theuss
- Applicant: Horst Theuss
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L23/34
- IPC: H01L23/34 ; H01L23/02
Abstract:
A device includes a first semiconductor chip and a first encapsulant that encapsulates the first semiconductor chip and that includes a cavity. A carrier and an electrical component are mounted on the carrier. The carrier is arranged such that the electrical component is enclosed by the cavity.
Public/Granted literature
- US20110241197A1 Device and Method for Manufacturing a Device Public/Granted day:2011-10-06
Information query
IPC分类:
