Invention Grant
US08350382B2 Semiconductor device including electronic component coupled to a backside of a chip
有权
包括耦合到芯片背面的电子部件的半导体器件
- Patent Title: Semiconductor device including electronic component coupled to a backside of a chip
- Patent Title (中): 包括耦合到芯片背面的电子部件的半导体器件
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Application No.: US11859353Application Date: 2007-09-21
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Publication No.: US08350382B2Publication Date: 2013-01-08
- Inventor: Edward Fürgut , Joachim Mahler , Michael Bauer
- Applicant: Edward Fürgut , Joachim Mahler , Michael Bauer
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Dicke, Billig & Czaja, PLLC
- Main IPC: H01L23/34
- IPC: H01L23/34 ; H01L23/48 ; H01L23/52 ; H01L29/40
Abstract:
A semiconductor package includes a substrate, at least one chip including a first side and a backside opposite of the first side, the first side electrically coupled to the substrate, a conductive layer coupled to the backside of the at least one chip, and at least one electronic component coupled to the conductive layer and in electrical communication with the substrate.
Public/Granted literature
- US20090079065A1 SEMICONDUCTOR DEVICE INCLUDING ELECTRONIC COMPONENT COUPLED TO A BACKSIDE OF A CHIP Public/Granted day:2009-03-26
Information query
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