Disclosed is a component built-in wiring board, including a first insulating layer; a second insulating layer positioned in a laminated state on the first insulating layer; a semiconductor element buried in the second insulating layer, having a semiconductor chip with terminal pads and having surface mounting terminals arrayed in a grid shape connected electrically with the terminal pads; an electric/electronic component further buried in the second insulating layer; a wiring pattern sandwiched between the first insulating layer and the second insulating layer, including a first mounting land for the semiconductor element and a second mounting land for the electric/electronic component; a first connecting member connecting electrically the surface mounting terminal of the semiconductor element with the first mounting land; and a second connecting member connecting electrically the terminals of the electric/electronic component with the second mounting land, made of a same material as a material of the first connecting member.