Invention Grant
US08350393B2 Apparatus and method for predetermined component placement to a target platform
有权
用于预定部件放置到目标平台的装置和方法
- Patent Title: Apparatus and method for predetermined component placement to a target platform
- Patent Title (中): 用于预定部件放置到目标平台的装置和方法
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Application No.: US12779046Application Date: 2010-05-13
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Publication No.: US08350393B2Publication Date: 2013-01-08
- Inventor: Kong-Chen Chen
- Applicant: Kong-Chen Chen
- Applicant Address: US CA Milpitas
- Assignee: Wintec Industries, Inc.
- Current Assignee: Wintec Industries, Inc.
- Current Assignee Address: US CA Milpitas
- Agency: Kilpatrick Townsend & Stockton LLP
- Main IPC: H01L23/544
- IPC: H01L23/544
Abstract:
The present invention relates generally to assembly techniques. According to the present invention, the alignment and probing techniques to improve the accuracy of component placement in assembly are described. More particularly, the invention includes methods and structures to detect and improve the component placement accuracy on a target platform by incorporating alignment marks on component and reference marks on target platform under various probing techniques. A set of sensors grouped in any array to form a multiple-sensor probe can detect the deviation of displaced components in assembly.
Public/Granted literature
- US20110119906A1 Apparatus and method for predetermined component placement to a target platform Public/Granted day:2011-05-26
Information query
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