Invention Grant
- Patent Title: Method and apparatus of deembedding
- Patent Title (中): 去镶嵌的方法和装置
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Application No.: US12496946Application Date: 2009-07-02
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Publication No.: US08350586B2Publication Date: 2013-01-08
- Inventor: Shu-Ying Cho , Jiun-Kai Huang , Wen-Sheh Huang , Sally Liu
- Applicant: Shu-Ying Cho , Jiun-Kai Huang , Wen-Sheh Huang , Sally Liu
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: G01R31/02
- IPC: G01R31/02 ; G06F11/22 ; H01L23/58

Abstract:
Provided is a method of de-embedding. The method includes forming a test structure having a device-under-test embedded therein, the test structure having left and right pads coupling the device-under-test, the device-under-test dividing the test structure into left and right half structures, the left and right half structures each having intrinsic transmission parameters; forming a plurality of dummy test structures, each dummy test structure including a left pad and a right pad; measuring transmission parameters of the test structure and the dummy test structures; and deriving intrinsic transmission parameters of the device-under-test using the intrinsic transmission parameters of the left and right half structures and the transmission parameters of the test structure and the dummy test structures.
Public/Granted literature
- US20110001504A1 METHOD AND APPARATUS OF DEEMBEDDING Public/Granted day:2011-01-06
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