Invention Grant
US08350664B2 Semiconductor resistance element, semiconductor module including the same, and processor-based system including the semiconductor module
有权
半导体电阻元件，包括该半导体元件的半导体模块以及包括该半导体模块的基于处理器的系统
- Patent Title: Semiconductor resistance element, semiconductor module including the same, and processor-based system including the semiconductor module
- Patent Title (中): 半导体电阻元件，包括该半导体元件的半导体模块以及包括该半导体模块的基于处理器的系统
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Application No.: US12957902Application Date: 2010-12-01
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Publication No.: US08350664B2Publication Date: 2013-01-08
- Inventor: Hyung-Mo Hwang , Hyun-Seok Choi , Young-Chul Park
- Applicant: Hyung-Mo Hwang , Hyun-Seok Choi , Young-Chul Park
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce
- Priority: KR10-2010-0018084 20100226
- Main IPC: H01C13/00
- IPC: H01C13/00
Abstract:
Provided may be a semiconductor resistance element including resistance patterns disposed on an insulating substrate. The substrate may have first and second planer surfaces disposed in a first direction, third and fourth planar surfaces at least between the first and second planar surfaces in a second direction and fifth and sixth planar surfaces at least between the first and second planar surfaces in a third direction. The semiconductor resistance element may include a first resistance pattern configured to cover a selected one of the first and second planar surfaces and a second resistance pattern on at least one of the third through sixth planar surfaces.
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