Invention Grant
- Patent Title: Antenna using buildup structure and method of manufacturing the same
- Patent Title (中): 天线采用积木结构及其制造方法
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Application No.: US12655058Application Date: 2009-12-21
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Publication No.: US08350760B2Publication Date: 2013-01-08
- Inventor: Ho-Jun Lee
- Applicant: Ho-Jun Lee
- Applicant Address: KR Seongnam-Si, Gyeonggi-Do
- Assignee: Korea Electronics Technology Institute
- Current Assignee: Korea Electronics Technology Institute
- Current Assignee Address: KR Seongnam-Si, Gyeonggi-Do
- Agency: Lowe Hauptman Ham & Berner, LLP
- Priority: KR10-2008-0133871 20081224
- Main IPC: H01Q1/38
- IPC: H01Q1/38
Abstract:
There are provided an antenna using a buildup structure and a method of manufacturing the same. In the antenna, a tag chip is positioned within a dielectric and is connected to a radiator through a connection line or a via-hole, thereby being strong against external environments, decreasing a defective rate and enabling to be used for the special purpose of being positioned within a metal or liquid.
Public/Granted literature
- US20100156744A1 Antenna using buildup structure and method of manufacturing the same Public/Granted day:2010-06-24
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