An LED circuit using a combination of series and parallel arrangements for optimum current sharing between LEDs. The current paths allow an LED to fail while minimizing the effect on other LEDs and noticeable luminance variance across the circuit. Some embodiments use metallic PCB technology which permits optimal thermal regulation of heat generated by the LEDs. Exemplary embodiments can be used with a single-layer PCB where only one layer of conducting material must be placed on the substrate. This results in a thinner, lighter, and cheaper assembly. The rear surface of the PCB may contain heat sinks or fins and may have air (or other gaseous matter) moved across the surface and/or heat sinks to facilitate cooling of the assembly. An LCD assembly using the same is also disclosed.