Invention Grant
- Patent Title: Chip type laminated capacitor
- Patent Title (中): 片式叠层电容器
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Application No.: US13531242Application Date: 2012-06-22
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Publication No.: US08351181B1Publication Date: 2013-01-08
- Inventor: Young Ghyu Ahn , Byoung Hwa Lee , Min Cheol Park , Young Hoon Song , Mi Hee Lee
- Applicant: Young Ghyu Ahn , Byoung Hwa Lee , Min Cheol Park , Young Hoon Song , Mi Hee Lee
- Applicant Address: KR Gyunggi-Do
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Gyunggi-Do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2011-0061345 20110623
- Main IPC: H01G4/06
- IPC: H01G4/06

Abstract:
There is provided a chip type laminated capacitor including: a ceramic body formed by laminating a dielectric layer having a thickness equal to 10 or more times an average particle diameter of a grain included therein and being 3 μm or less; first and second outer electrodes; a first inner electrode having one end forming a first margin together with one end surface of the ceramic body at which the second outer electrode is formed and the other end leading to the first outer electrode; and a second inner electrode having one end forming a second margin together with the other end surface of the ceramic body at which the first outer electrode is formed and the other end leading to the second outer electrode, wherein the first and second margins have different widths under a condition that they are 200 μm or less.
Public/Granted literature
- US20120327557A1 CHIP TYPE LAMINATED CAPACITOR Public/Granted day:2012-12-27
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