Invention Grant
- Patent Title: Mainframe structure
- Patent Title (中): 主机架构
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Application No.: US12981148Application Date: 2010-12-29
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Publication No.: US08351194B2Publication Date: 2013-01-08
- Inventor: Kang Ku , Hsien-Tang Liu , Wen-Cheng Liu
- Applicant: Kang Ku , Hsien-Tang Liu , Wen-Cheng Liu
- Applicant Address: TW Jhonghe, Taipei Hsien
- Assignee: Datavan International Corp.
- Current Assignee: Datavan International Corp.
- Current Assignee Address: TW Jhonghe, Taipei Hsien
- Agency: Muncy, Geissler, Olds & Lowe, PLLC
- Main IPC: H05K5/00
- IPC: H05K5/00 ; H05K7/20 ; F28F7/00

Abstract:
A mainframe structure includes a housing having a detachable front cover, and a circuit module accommodated in the housing. The circuit module includes a main circuit board affixed to the back side of the detachable front cover in vertical and carrying first and second electrical connectors, a chip (or chips) and memory devices, a functional circuit board horizontally mounted in the housing at the bottom side and having a first connection port connected to the first electrical connector of the main circuit board, and a display circuit board vertically mounted in the housing at the top side and having a second connection port connected to the second electrical connector of the main circuit board. The detachable design of the circuit module minimizes the sizes of the main circuit board and facilitates maintenance of the main circuit board.
Public/Granted literature
- US20120170199A1 MAINFRAME STRUCTURE Public/Granted day:2012-07-05
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