Invention Grant
- Patent Title: Modular data processing components and systems
- Patent Title (中): 模块化数据处理组件和系统
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Application No.: US12864230Application Date: 2008-01-31
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Publication No.: US08351204B2Publication Date: 2013-01-08
- Inventor: Jong-Souk Yeo , R. Stanley Williams , Chandrakant D. Patel , Duncan R. Stewart
- Applicant: Jong-Souk Yeo , R. Stanley Williams , Chandrakant D. Patel , Duncan R. Stewart
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- International Application: PCT/US2008/052637 WO 20080131
- International Announcement: WO2009/096974 WO 20090806
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H05K5/00 ; G02B6/00 ; H04B10/00
Abstract:
Data processing modules including a housing and optical interfaces associated with the exterior of the housing, and systems including the same.
Public/Granted literature
- US20100321880A1 MODULAR DATA PROCESSING COMPONENTS AND SYSTEMS Public/Granted day:2010-12-23
Information query
