Invention Grant
- Patent Title: Attachment structure of an attached-plate of a substrate
- Patent Title (中): 衬底附着板的附着结构
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Application No.: US12186684Application Date: 2008-08-06
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Publication No.: US08351211B2Publication Date: 2013-01-08
- Inventor: Shinichi Maeda , Yasue Chihara , Yuji Ariyoshi
- Applicant: Shinichi Maeda , Yasue Chihara , Yuji Ariyoshi
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2007-205106 20070807
- Main IPC: H05K5/00
- IPC: H05K5/00 ; H05K7/00

Abstract:
In an attachment structure for attaching an attached-plate to a printed substrate which is installed in a mechanical chassis, the mechanical chassis includes a positioning pin for positioning the printed substrate; and the attached-plate includes a guide groove that engages with the positioning pin and is slidably guided in a predetermined path, a fixing portion to the printed substrate, and an engaging portion that engages with a side portion of the printed substrate. By causing the attached-plate to slide along a substrate side of the printed substrate with the guide groove being engaged with the positioning pin, the guide groove is guided by the positioning pin, whereby the engaging portion engages with the side portion of the printed substrate. In the engagement state, by fixing the fixing portion of the attached-plate to the printed substrate, the attached-plate is attached to the printed substrate.
Public/Granted literature
- US20090046438A1 ATTACHMENT STRUCTURE OF AN ATTACHED-PLATE OF A SUBSTRATE Public/Granted day:2009-02-19
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