Invention Grant
- Patent Title: Method of manufacturing a chip embedded printed circuit board
- Patent Title (中): 芯片嵌入式印刷电路板的制造方法
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Application No.: US12320523Application Date: 2009-01-28
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Publication No.: US08351215B2Publication Date: 2013-01-08
- Inventor: Hong Won Kim , Sung Yi , Tae Sung Jeong , Joon Seok Kang
- Applicant: Hong Won Kim , Sung Yi , Tae Sung Jeong , Joon Seok Kang
- Applicant Address: KR Suwon
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon
- Priority: KR10-2008-0120429 20081201
- Main IPC: H05K3/00
- IPC: H05K3/00
Abstract:
The present invention relates to a chip embedded printed circuit board and a manufacturing method thereof. The present invention provides the chip embedded printed circuit board including an insulating layer embedding a chip provided with posts at an upper part, vias formed through the insulating layer, upper patterns formed at the upper part of the insulating layer to be connected to the posts and the vias and lower patterns formed at a lower part of the insulating layer to be connected to the vias, and the manufacturing method thereof.
Public/Granted literature
- US20100134991A1 Chip embedded printed circuit board and manufacturing method thereof Public/Granted day:2010-06-03
Information query
