Invention Grant
- Patent Title: Layered structure connection and assembly
- Patent Title (中): 分层结构连接和组装
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Application No.: US12667766Application Date: 2008-06-10
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Publication No.: US08351216B2Publication Date: 2013-01-08
- Inventor: Christopher William Fotherby
- Applicant: Christopher William Fotherby
- Applicant Address: NZ Manukau
- Assignee: Power Concepts NZ Limited
- Current Assignee: Power Concepts NZ Limited
- Current Assignee Address: NZ Manukau
- Agency: Dann, Dorfman, Herrell and Skillman, P.C.
- Priority: NZ556439 20070709
- International Application: PCT/NZ2008/000135 WO 20080610
- International Announcement: WO2009/008741 WO 20090115
- Main IPC: H05K7/00
- IPC: H05K7/00
Abstract:
The present invention relates to a layered structure assembly (1) for a DC to AC inverter comprising: a first layered structure (10) with first (12) and second (13) conductive layers, a second layered structure (14) with third (16) and fourth (17) conductive layers, and at least one connector (21) providing a low resistance/inductance interconnection between layered structures (10, 14), the connecter (21) comprising a rod (23) inside a sleeve (26).
Public/Granted literature
- US20100195301A1 Layered Structure Connection and Assembly Public/Granted day:2010-08-05
Information query
