Invention Grant
- Patent Title: Wiring board
- Patent Title (中): 接线板
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Application No.: US12639252Application Date: 2009-12-16
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Publication No.: US08351217B2Publication Date: 2013-01-08
- Inventor: Yuji Watanabe
- Applicant: Yuji Watanabe
- Applicant Address: JP Tokyo
- Assignee: Elpida Memory, Inc.
- Current Assignee: Elpida Memory, Inc.
- Current Assignee Address: JP Tokyo
- Agency: Foley & Lardner LLP
- Priority: JP2008-327641 20081224
- Main IPC: H05K7/00
- IPC: H05K7/00 ; H05K1/16 ; H01L23/495 ; H01L23/28
Abstract:
A wiring board of the present invention comprises a plurality of device formation areas each for mounting a semiconductor chip thereon, and two or more slits formed in an area which comes into contact with a molding die when the wiring board is placed in a cavity of the molding die for forming a sealant to collectively cover the plurality of device formation areas.
Public/Granted literature
- US20100155110A1 WIRING BOARD Public/Granted day:2010-06-24
Information query
