Invention Grant
- Patent Title: Silicon-based microphone structure with electromagnetic interference shielding means
- Patent Title (中): 具有电磁干扰屏蔽手段的硅基麦克风结构
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Application No.: US12264967Application Date: 2008-11-05
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Publication No.: US08351635B2Publication Date: 2013-01-08
- Inventor: Chih Sun , Shih-Chin Gong
- Applicant: Chih Sun , Shih-Chin Gong
- Applicant Address: US CA Sunnyvale
- Assignee: Fortemedia, Inc.
- Current Assignee: Fortemedia, Inc.
- Current Assignee Address: US CA Sunnyvale
- Agency: McClure, Qualey & Rodack, LLP
- Main IPC: H04R11/04
- IPC: H04R11/04
Abstract:
A silicon-based microphone structure, flip-chip mounted a substrate, has a backside and a via hole formed on the backside. A conductive layer covers the backside and the inner walls of the via hole. A solder ring is attached to the silicon-based microphone structure and electrically connected to the conductive layer.
Public/Granted literature
- US20100111344A1 SILICON-BASED MICROPHONE STRUCTURE WITH ELECTROMAGNETIC INTERFERENCE SHIELDING MEANS Public/Granted day:2010-05-06
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