Invention Grant
- Patent Title: Suspension board with circuit and producing method thereof
- Patent Title (中): 具有电路的悬挂板及其制造方法
-
Application No.: US12458223Application Date: 2009-07-06
-
Publication No.: US08351743B2Publication Date: 2013-01-08
- Inventor: Toshiki Naito , Jun Ishii
- Applicant: Toshiki Naito , Jun Ishii
- Applicant Address: JP Osaka
- Assignee: Nitto Denko Corporation
- Current Assignee: Nitto Denko Corporation
- Current Assignee Address: JP Osaka
- Agency: Edwards Neils PLLC
- Agent Jean C. Edwards, Esq.
- Priority: JP2008-177203 20080707
- Main IPC: G02B6/12
- IPC: G02B6/12 ; G02B6/26 ; G02B6/42
Abstract:
A suspension board with circuit includes a metal supporting board; an insulating base layer formed on the metal supporting board; a conductive pattern formed on the insulating base layer; an insulating cover layer formed on the insulating base layer so as to cover the conductive pattern; and an optical waveguide. The optical waveguide is provided on the metal supporting board separately from the insulating base layer, the conductive pattern, and the insulating cover layer.
Public/Granted literature
- US20100000774A1 Suspension board with circuit and producing method thereof Public/Granted day:2010-01-07
Information query
