Invention Grant
- Patent Title: Distribution of cooling resources using hierarchically identified cooling microgrids
- Patent Title (中): 使用分层识别的冷却微电网分配冷却资源
-
Application No.: US12770186Application Date: 2010-04-29
-
Publication No.: US08352085B2Publication Date: 2013-01-08
- Inventor: Manish Marwah , Ratnesh Kumar Sharma , Amip J. Shah , Thomas W. Christian , Cullen E. Bash , Zhikui Wang , Chandrakant Patel
- Applicant: Manish Marwah , Ratnesh Kumar Sharma , Amip J. Shah , Thomas W. Christian , Cullen E. Bash , Zhikui Wang , Chandrakant Patel
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company L.P.
- Current Assignee: Hewlett-Packard Development Company L.P.
- Current Assignee Address: US TX Houston
- Main IPC: G05D23/00
- IPC: G05D23/00

Abstract:
In a method for distributing cooling resources to a plurality of locations using a plurality of hierarchically identified cooling microgrids, conditions detected at the plurality of locations are received. Each level of the hierarchically identified cooling microgrids is a plurality of resource actuators configured to vary distribution of the cooling resources. Settings for the plurality of resource actuators in each of the levels in the cooling microgrid hierarchy that substantially maintain conditions at the plurality of locations within predetermined ranges are determined using a processor, while substantially optimizing at least one measure of performance associated with supplying the cooling resources to the plurality of locations.
Public/Granted literature
- US20110270464A1 DISTRIBUTION OF COOLING RESOURCES USING HIERARCHICALLY IDENTIFIED COOLING MICROGRIDS Public/Granted day:2011-11-03
Information query