Invention Grant
- Patent Title: Model import for electronic design automation
- Patent Title (中): 电子设计自动化模型导入
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Application No.: US13116958Application Date: 2011-05-26
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Publication No.: US08352888B2Publication Date: 2013-01-08
- Inventor: Ru-Gun Liu , Chih-Ming Lai , Wen-Chun Huang , Boren Luo , I-Chang Shin , Yao-Ching Ku , Cliff Hou
- Applicant: Ru-Gun Liu , Chih-Ming Lai , Wen-Chun Huang , Boren Luo , I-Chang Shin , Yao-Ching Ku , Cliff Hou
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
Methods and systems for providing processing parameters in a secure format are disclosed. In one aspect, a method for providing semiconductor fabrication processing parameters to a design facility is disclosed. The method comprises providing a set of processing parameters of a fabrication facility; creating a model from the set of processing parameters; converting the model into a corresponding set of kernels; converting the set of kernels into a corresponding set of matrices; and communicating the set of matrices to the design facility. In another aspect, a method for providing semiconductor fabrication processing parameters is disclosed. The method comprises providing a set of processing parameters of a fabrication facility; creating a processing model from the set of processing parameters; encrypting the processing model into a format for use with a plurality of EDA tools; and communicating the encrypted processing model format to a design facility.
Public/Granted literature
- US20110230998A1 MODEL IMPORT FOR ELECTRONIC DESIGN AUTOMATION Public/Granted day:2011-09-22
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