Invention Grant
- Patent Title: Implementing routing first for rapid prototyping and improved wiring of heterogeneous hierarchical integrated circuits
- Patent Title (中): 实现路由优先用于快速原型设计和改进异构分层集成电路的布线
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Application No.: US12902343Application Date: 2010-10-12
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Publication No.: US08352902B2Publication Date: 2013-01-08
- Inventor: Thomas Charles Brennan , Robert Francis Lembach
- Applicant: Thomas Charles Brennan , Robert Francis Lembach
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Joan Pennington
- Main IPC: G06F17/50
- IPC: G06F17/50
Abstract:
A method, system and computer program product are provided for implementing routing first for rapid prototyping and improved wiring of heterogeneous hierarchical integrated circuit chips. Placement for each of a plurality of random logic macros (RLMs) is identified. Predefined wiring shapes are created for each of the identified RLMs. Full chip wire routing is defined responsive to the created predefined wiring shapes for each of the identified RLMs.
Public/Granted literature
Information query
