- 专利标题: Silicon germanium film formation method and structure
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申请号: US13025474申请日: 2011-02-11
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公开(公告)号: US08354314B2公开(公告)日: 2013-01-15
- 发明人: Ashima B. Chakravarti , Abhishek Dube , Dominic J. Schepis
- 申请人: Ashima B. Chakravarti , Abhishek Dube , Dominic J. Schepis
- 申请人地址: US NY Armonk
- 专利权人: International Business Machines Corporation
- 当前专利权人: International Business Machines Corporation
- 当前专利权人地址: US NY Armonk
- 代理机构: Hoffman Warnick LLC
- 代理商 Katherine S. Brown
- 主分类号: H01L21/8238
- IPC分类号: H01L21/8238
摘要:
Epitaxial deposition of silicon germanium in a semiconductor device is achieved without using masks. Nucleation delays induced by interactions with dopants present before deposition of the silicon germanium are used to determine a period over which an exposed substrate surface may be subjected to epitaxial deposition to form a layer of SiGe on desired parts with substantially no deposition on other parts. Dopant concentration may be changed to achieve desired thicknesses within preferred deposition times. Resulting deposited SiGe is substantially devoid of growth edge effects.
公开/授权文献
- US08389352B2 Silicon germanium film formation method and structure 公开/授权日:2013-03-05
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