Invention Grant
- Patent Title: Microcavity light emitting diode method of manufacture
- Patent Title (中): 微腔发光二极管制造方法
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Application No.: US12569337Application Date: 2009-09-29
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Publication No.: US08354679B1Publication Date: 2013-01-15
- Inventor: Mark P. D'Evelyn , Rajat Sharma
- Applicant: Mark P. D'Evelyn , Rajat Sharma
- Applicant Address: US CA Fremont
- Assignee: SORAA, Inc.
- Current Assignee: SORAA, Inc.
- Current Assignee Address: US CA Fremont
- Agency: Kilpatrick Townsend & Stockton LLP
- Main IPC: H01L27/15
- IPC: H01L27/15 ; H01L29/26 ; H01L31/12 ; H01L33/00

Abstract:
A high efficiency microcavity light emitting diode comprises a stack of AlxInyGa1-x-yN layers, where 0≦x, y, x+y≦1, with each layer having a high crystalline quality. The stack has a uniform thickness less than 6λ/n, with an active layer centered approximately (2i+1)λ/(4n) from a reflective electrical contact, where λ is the peak emission wavelength, n is the index of refraction at the peak emission wavelength, i is an integer, and each layer within the stack has a dislocation density below about 105 cm−2.
Public/Granted literature
- US2152592A Pile fabric loom Public/Granted day:1939-03-28
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