发明授权
US08354853B2 Test electronics to device under test interfaces, and methods and apparatus using same
有权
测试电子设备到被测设备的接口,以及使用它们的方法和设备
- 专利标题: Test electronics to device under test interfaces, and methods and apparatus using same
- 专利标题(中): 测试电子设备到被测设备的接口,以及使用它们的方法和设备
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申请号: US12626506申请日: 2009-11-25
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公开(公告)号: US08354853B2公开(公告)日: 2013-01-15
- 发明人: Sanjeev Grover , Donald W. Chiu , John W. Andberg
- 申请人: Sanjeev Grover , Donald W. Chiu , John W. Andberg
- 申请人地址: SG Singapore
- 专利权人: Advantest (Singapore) Pte Ltd
- 当前专利权人: Advantest (Singapore) Pte Ltd
- 当前专利权人地址: SG Singapore
- 代理机构: Holland & Hart LLP
- 主分类号: G01R31/00
- IPC分类号: G01R31/00
摘要:
In one embodiment, a test system has a set of test electronics for testing a device under test (DUT). The test system also has at least one test electronics to DUT interface having a zero insertion force (ZIF) connector. Each ZIF connector has a ZIF connector to DUT clamping mechanism configured to i) apply a first orthogonal force to a probe card that interfaces with a DUT, by pressing the ZIF connector against the probe card, and simultaneously ii) exert at least one second orthogonal force on the probe card, the at least one second orthogonal force being opposite in direction to the first orthogonal force.
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