发明授权
US08357443B2 Laminate including water soluble release layer for producing circuit board and method of producing circuit board
有权
包括用于生产电路板的水溶性释放层和生产电路板的方法的层压板
- 专利标题： Laminate including water soluble release layer for producing circuit board and method of producing circuit board
- 专利标题（中）： 包括用于生产电路板的水溶性释放层和生产电路板的方法的层压板
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申请号： US12551802申请日： 2009-09-01
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公开(公告)号： US08357443B2公开(公告)日： 2013-01-22
- 发明人: Hirohisa Narahashi , Shigeo Nakamura , Tadahiko Yokota
- 申请人： Hirohisa Narahashi , Shigeo Nakamura , Tadahiko Yokota
- 申请人地址： JP Tokyo
- 专利权人： Ajinomoto Co., Inc.
- 当前专利权人： Ajinomoto Co., Inc.
- 当前专利权人地址： JP Tokyo
- 代理机构： Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- 优先权： JP2007-052055 20070301; JP2007-052060 20070301; JP2007-216342 20070822
- 主分类号： B32B9/00
- IPC分类号： B32B9/00 ; B32B33/00 ; B32B17/10 ; B32B27/08 ; G11B11/105 ; G11B5/64 ; C09J7/02 ; H05K1/00 ; H05K1/03 ; B29C53/82
摘要：
Producing a circuit board, by laminating, on a substrate, an adhesive film with a metal film, which comprises a water-soluble polymer release layer, a metal film layer and a curable resin composition layer, which are formed in this order on a support layer, and has a release property enabling detachment of said water-soluble polymer release layer from the support layer after curing of the curable resin composition layer, such that the curable resin composition layer contacts the substrate; curing the curable resin composition layer; detaching the support layer, and removing the water-soluble polymer release layer present on the metal film layer by dissolving the release layer in an aqueous solution, efficiently forms an insulating layer and a metal film layer superior in adhesiveness to the insulating layer and in uniformity.
公开/授权文献
- US20100044078A1 PROCESS FOR PRODUCING CIRCUIT BOARD 公开/授权日：2010-02-25
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