发明授权
US08358144B2 Method for manufacturing semiconductor device, semiconductor inspection device, and program including color imaging of metal silicide
有权
半导体装置的制造方法,半导体检查装置以及包含金属硅化物的彩色成像的程序
- 专利标题: Method for manufacturing semiconductor device, semiconductor inspection device, and program including color imaging of metal silicide
- 专利标题(中): 半导体装置的制造方法,半导体检查装置以及包含金属硅化物的彩色成像的程序
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申请号: US12912879申请日: 2010-10-27
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公开(公告)号: US08358144B2公开(公告)日: 2013-01-22
- 发明人: Hotaka Maruyama , Masumi Mitsubori , Kaoru Kato
- 申请人: Hotaka Maruyama , Masumi Mitsubori , Kaoru Kato
- 申请人地址: JP Atsugi-shi, Kanagawa-ken
- 专利权人: Semiconductor Energy Laboratory Co., Ltd.
- 当前专利权人: Semiconductor Energy Laboratory Co., Ltd.
- 当前专利权人地址: JP Atsugi-shi, Kanagawa-ken
- 代理机构: Fish & Richardson P.C.
- 优先权: JP2005-378220 20051228
- 主分类号: H01L21/66
- IPC分类号: H01L21/66 ; H01L21/4763
摘要:
A manufacturing method of a semiconductor device capable of efficiently inspecting whether a metal silicide layer is sufficiently formed is provided. The manufacturing method is provided with the steps of forming a metal layer over a semiconductor layer containing silicon; forming a metal silicide layer over a surface of the semiconductor layer by heating the semiconductor layer and the metal layer; generating image data by performing color imaging of the metal silicide layer from above the metal silicide layer; calculating saturation of the metal silicide layer by processing the image data; and judging the formation amount of the metal silicide layer on the basis of the calculated saturation.
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