发明授权
- 专利标题： Temperature compensated MEMS device
- 专利标题（中）： 温度补偿MEMS器件
-
申请号： US10757104申请日： 2004-01-13
-
公开(公告)号： US08358296B2公开(公告)日： 2013-01-22
- 发明人: Daryl E. Anderson , Eric Martin
- 申请人： Daryl E. Anderson , Eric Martin
- 申请人地址： US TX Houston
- 专利权人： Hewlett-Packard Development Company, L.P.
- 当前专利权人： Hewlett-Packard Development Company, L.P.
- 当前专利权人地址： US TX Houston
- 主分类号： G09G5/00
- IPC分类号： G09G5/00
摘要：
A micro-electromechanical system (MEMS) includes a flexure, a voltage generator, and a temperature sensor thermally coupled to the MEMS, wherein the voltage generator is configured to produce a temperature compensated voltage in response to a thermal measurement performed by the temperature sensor.
公开/授权文献
- US20050152015A1 Temperature compensated MEMS device 公开/授权日：2005-07-14