发明授权
- 专利标题: Thermal humidity sensor
- 专利标题(中): 热湿度传感器
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申请号: US12855347申请日: 2010-08-12
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公开(公告)号: US08359919B2公开(公告)日: 2013-01-29
- 发明人: Masahiro Matsumoto , Hiroshi Nakano , Keiji Hanzawa , Masamichi Yamada
- 申请人: Masahiro Matsumoto , Hiroshi Nakano , Keiji Hanzawa , Masamichi Yamada
- 申请人地址: JP Hitachinaka-shi
- 专利权人: Hitachi Automotive Systems, Ltd.
- 当前专利权人: Hitachi Automotive Systems, Ltd.
- 当前专利权人地址: JP Hitachinaka-shi
- 代理机构: Crowell & Moring LLP
- 优先权: JP2009-198159 20090828
- 主分类号: G01N27/12
- IPC分类号: G01N27/12 ; G01N27/18 ; G01F1/69
摘要:
Provided is a high-precision, mechanically robust thermal humidity sensor. A detecting element 1 of the thermal humidity sensor of the present invention has a diaphragm (a bridge structure) 2 formed on a planar substrate which is formed from a material with high thermal conductivity such as silicon or ceramic. Formed on the diaphragm 2 are temperature detecting resistors 4, 5, 6, and 7 and a heating resistor 3 arranged in a manner surrounding the temperature detecting resistors. Humidity is detected based on the outputs of the temperature detecting resistors 4, 5, 6, and 7. Accordingly, humidity measurement errors that can possibly occur due to the leakage of heat through the diaphragm 2 to the planar substrate can be reduced.
公开/授权文献
- US20110048127A1 Thermal Humidity Sensor 公开/授权日:2011-03-03
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