Invention Grant
- Patent Title: Signal transmission for high speed interconnections
- Patent Title (中): 用于高速互连的信号传输
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Application No.: US13166155Application Date: 2011-06-22
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Publication No.: US08361896B2Publication Date: 2013-01-29
- Inventor: Jan De Geest
- Applicant: Jan De Geest
- Applicant Address: FR Guyancourt
- Assignee: FCI
- Current Assignee: FCI
- Current Assignee Address: FR Guyancourt
- Agency: Woodcock Washburn LLP
- Main IPC: H01R13/648
- IPC: H01R13/648

Abstract:
A connector assembly includes a substrate and a connector. The substrate includes a ground layer and a trace layer. The substrate defines a substrate edge, and the ground layer defines a ground edge. The connector is mounted on the substrate such that a portion of the connector overhangs the substrate edge of the substrate. The connector includes a first signal contact that defines a mating portion, a mounting portion, a first transition portion connected to the mating portion, and a second transition portion connected to the first transition portion and the mounting portion. The first transition portion of the signal contact at least partially crosses the ground edge such that a gap is defined between the ground edge and the first transition portion and a substantial portion of the second transition portion extends over the gap when the electrical connector is mounted on the substrate.
Public/Granted literature
- US20110318962A1 SIGNAL TRANSMISSION FOR HIGH SPEED INTERCONNECTIONS Public/Granted day:2011-12-29
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